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| GaAs-IR-Lumineszenzdiode GaAs Infrared Emitter Lead (Pb) Free Product - RoHS Compliant SFH 400 SFH 401 SFH 400 SFH 401 Wesentliche Merkmale * Kathode galvanisch mit dem Gehauseboden verbunden * Hohe Zuverlassigkeit * Gute spektrale Anpassung an Si-Fotoempfanger * Hermetisch dichtes Metallgehause * SFH 401: Gehausegleich mit BPX 43, BPY 62 Anwendungen * Lichtschranken fur Gleich- und Wechsellichtbetrieb * IR-Geratefernsteuerungen * Sensorik * Lichtgitter Features * * * * * Cathode is electrically connected to the case High reliability Matches all Si-Photodetectors Hermetically sealed package SFH 401: Same package as BPX 43, BPY 62 Applications * * * * Photointerrupters IR remote control Sensor technology Light curtains Typ Type SFH 400 SFH 401 Bestellnummer Ordering Code Q62702P0096 Q62702P0097 Gehause Package 18 A3 DIN 41876 (TO-18), Glaslinse, hermetisch dichtes Gehause, Anschlusse im 2.54-mm-Raster (1/10'') 18 A3 DIN 41876 (TO-18) glass lens, hermetically sealed package, solder tabs lead spacing 2.54 mm (1/10'') 2007-12-07 1 SFH 400, SFH 401 Grenzwerte (TC = 25 C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range SFH 400 Betriebs- und Lagertemperatur Operating and storage temperature range SFH 401 Sperrspannung Reverse voltage Durchlassstrom Forward current Stostrom, tp = 10 s, D = 0 Surge current Verlustleistung Power dissipation Warmewiderstand Thermal resistance Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA, tp= 20ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA, tp= 20ms Abstrahlwinkel Half angle SFH 400 SFH 401 Aktive Chipflache Active chip area Abmessungen der aktiven Chipflache Dimension of the active chip area Symbol Symbol peak Wert Value 950 Einheit Unit nm Symbol Symbol Wert Value - 40 ... + 125 Einheit Unit C Top; Tstg Top; Tstg - 40 ... + 100 C VR IF IFSM Ptot RthJA RthJC 5 300 3 470 450 160 V mA A mW K/W K/W 55 nm 6 15 0.25 0.5 x 0.5 Grad deg. mm2 mm2 A LxB LxW 2007-12-07 2 SFH 400, SFH 401 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Abstand Chipoberflache bis Linsenscheitel Distance chip front to lens top SFH 400 SFH 401 Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Kapazitat Capacitance VR = 0 V, f = 1 MHz Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s Sperrstrom Reverse current VR = 5 V Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms Temperaturkoeffizient von Ie bzw. e, IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA Symbol Symbol Wert Value Einheit Unit H H tr , tf 4.0 ... 4.8 2.8 ... 3.7 1 mm mm s Co 40 pF VF VF IR 1.30 ( 1.5) 1.90 ( 2.5) 0.01 ( 1) V V A e 8 mW TCI - 0.55 %/K TCV TC - 1.5 + 0.3 mV/K nm/K 2007-12-07 3 SFH 400, SFH 401 Gruppierung der Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.01 sr Grouping of Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Symbol Symbol Wert Value SFH 400-2 SFH 400-3 SFH 401-2 SFH 401-3 Einheit Unit Ie min Ie max 20 40 > 32 - 10 20 >16 - mW/sr mW/sr Ie typ. 300 320 120 190 mW/sr 2007-12-07 4 SFH 400, SFH 401 Radiation Characteristics, SFH 400, Irel = f () 40 30 20 10 0 1.0 OHR01883 50 0.8 60 0.6 70 0.4 80 90 0.2 0 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 Radiation Characteristics, SFH 401, Irel = f () 40 30 20 10 0 1.0 OHR01884 50 0.8 60 0.6 70 0.4 80 90 0.2 0 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 2007-12-07 5 SFH 400, SFH 401 Relative Spectral Emission Irel = f () 100 % OHRD1938 Radiant Intensity Ie = f (IF) Ie 100 mA OHR01037 Single pulse, tp = 20 s e 10 2 Max. Permissible Forward Current SFH 401, IF = f (TA) 350 OHR00486 e (100 mA) rel F mA 300 250 200 150 80 10 1 60 R thJC = 160 K/W 40 10 20 0 R thJA = 450 K/W 100 50 0 880 920 960 1000 nm 1060 10 -1 10 -2 10 -1 10 0 A F 10 1 0 0 20 40 60 80 C 100 TA , TC Forward Current IF = f (VF) Permissible Pulse Handling Capability IF = f (), TC = 25 C, RthJC = 160 K/W,duty cycle D = parameter OHR01040 Max. Permissible Forward Current SFH 400, IF = f (TA) F 10 1 A F 10 4 mA 5 D= OHR01937 350 OHR00395 tP tP T F T D= 0.005 0.01 0.02 0.05 0.1 F mA 300 250 200 150 R thJA = 450 K/W 100 50 10 0 typ. max. R thJC = 160 K/W 10 3 5 0.2 0.5 10 -1 DC 10 -2 1 1.5 2 2.5 3 3.5 4 V 4.5 VF 10 2 10 -5 10 -4 10 -3 10 -2 s 10 0 0 0 20 40 60 80 100 C 130 TA , TC 2007-12-07 6 SFH 400, SFH 401 Mazeichnung Package Outlines 1. 0. 1 (0 9 (0 .043 .0 35 ) ) 1 1. 9 0. ) 43 ) .0 (0 035 . (0 SFH 400 (2.7 (0.106)) o0.45 (0.018) Chip position o4.8 (0.189) o4.6 (0.181) Anode = SFH 480 Cathode = SFH 216, SFH 400 (package) 2.54 (0.100) spacing welded 5.3 (0.209) 5.0 (0.197) 14.5 (0.571) 12.5 (0.492) glass lens 7.4 (0.291) 6.6 (0.260) o5.6 (0.220) o5.3 (0.209) GEOY6314 .0 (0 1 1. 0. 9 1. 1 0. (0 9 .0 (0 43 .0 ) 35 ) 43 ) 35 Anode = SFH 481 Cathode = SFH 401 (package) SFH 401 (2.7 (0.106)) o0.45 (0.018) Chip position o4.8 (0.189) o4.6 (0.181) 2.54 (0.100) spacing welded 5.3 (0.209) 5.0 (0.197) 14.5 (0.571) 12.5 (0.492) glass lens 6.4 (0.252) 5.6 (0.220) (0 .0 ) o5.6 (0.220) o5.3 (0.209) GETY6091 Mae in mm (inch) / Dimensions in mm (inch). 2007-12-07 7 SFH 400, SFH 401 Lotbedingungen Soldering Conditions Wellenloten (TTW) TTW Soldering 300 C T 250 235 C ... 260 C 2. Welle 2. wave 200 1. Welle 1. wave 150 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling ca 200 K/s 5 K/s 2 K/s (nach CECC 00802) (acc. to CECC 00802) OHLY0598 10 s Normalkurve standard curve Grenzkurven limit curves 0 0 50 100 150 t 200 s 250 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-12-07 8 |
Price & Availability of SFH400
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